Paquete híbrido del circuito integrado
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Paquete híbrido inferior extendido del circuito integrado que suelda
Precio: Negotiable
MOQ: 50 PCS
El tiempo de entrega: 30 Days
Marca: JOPTEC
Destacar:Extended Bottom hermetic IC package, Bottom Brazing Integrated Circuit Package, joptec Extended Hybrid Integrated Package
Product name: Metal Base Cavity Kovar/Aluminium Package for IC Finish: Fully plating Au. (Fully plating or selective plating Au.) Plating Coating Header and lid are plated Ni:1.3~11.43um and civil levelHeader is plated Au ≥1um military level:Header is plated Au≥1.3um;Lid:civil level Lid is plated Au... Ver más
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Paquete híbrido de cerámica del circuito integrado del chapado en oro SMD
Precio: Negotiable
MOQ: 50 PCS
El tiempo de entrega: 30 Days
Marca: JOPTEC
Destacar:SMD Hybrid Integrated Circuit Package, Gold Plating Ceramic Integrated Package, JOPTEC Integrated Circuit Package
Technical characteristics: Micro channel heat sink Flatness of chip mounting area ≤ 2 um Roughness of chip mounting area ≤ 0.3 um Plating thickness: Ni (2-5um) Au (0.05-0.15um) Water flow ≥ 300ml/min High thermal conductivity aluminum nitride ceramic heat sink Types of Ceramic: Aluminum Nitride AlN ... Ver más
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Paquete híbrido de cerámica del circuito integrado del aislador Al2O3 del metal
Precio: Negotiable
MOQ: 50 PCS
El tiempo de entrega: 30 Days
Marca: JOPTEC
Destacar:CRS1010 housing Integrated Circuit Package, parallel sealing cap GJB548 hermetic package, Ceramic Al2O3 Integrated Circuit Package
Product name: High quality Customized Ceramic To Metal Sealing Package Product formation Material Quantity bottom CS1010 1 lead1 oxgyen free copper 4 lead 2 copper cored alloy 8 insulator Al2O3 12 Plating coating: Coating: shell and lead plating Ni:3-11.43um, lead plating Au>=1.3um. Hermeticity: ... Ver más
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Paquete híbrido hermético del circuito integrado
Precio: Negotiable
MOQ: 50 PCS
El tiempo de entrega: 30 Days
Marca: JOPTEC
Destacar:modulator hybrid microcircuit Package, Kovar miniaturized electronic circuit Package, Kovar Hybrid IC Packages
Main performance parameters Application fields: DCDC power supply, filter, modulator Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm Gold layer thickness:> 0.45μm Hermeticity: leak rate ≤1x10-3Pa.cm3/s(He) Insulation resistance: ≥1000MΩ (DC500V) material: Base:... Ver más
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