Equipo de moldeo de semiconductores
(25)
Equipo de procesamiento de semiconductores de enfriamiento por agua Sistema de moldeo de semicones Alta presión
Precio: Negotiable
MOQ: 1 set
El tiempo de entrega: 40 days
Marca: TJIN
Destacar:Water Cooling Semiconductor Processing Equipment, Water Cooling Semicon Molding System, High Pressure Semiconductor Processing Equipment
Semicon Molding System Product Detail: Product Name: Semiconductor Molding Equipment Energy Consumption: Low Control System: PLC Application: Semiconductor Industry Molding Method: Injection Molding Capacity: High Plasticizing Press Plasticizing Press Plasticizing Press PLC Control System ● The auto... Ver más
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Equipo de moldeo de semiconductores de 1000 toneladas Dispositivo de sellado de plástico de alta precisión
Precio: Negotiable
MOQ: 1 set
El tiempo de entrega: 40 days
Marca: TJIN
Destacar:1000 Tons Semiconductor Molding Equipment, Semiconductor Molding Equipment High Precision, semiconductor molding machine High Precision
Automatic Semiconductor Plastic seal Device FAQ: Q: What is the brand name of this product? A: The brand name of this product is TJIN. Q: What is the model number of this product? A: The model number of this product is 002. Q: Where is this product manufactured? A: This product is manufactured in Ch... Ver más
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Equipo de moldeo de semiconductores totalmente automático
Precio: Negotiable
MOQ: 1 set
El tiempo de entrega: 40 days
Marca: TJIN
Destacar:Fully Automatic Semiconductor Molding Equipment, Fully Automatic Semiconductor Molding machine
Fully Automatic Transfer Molding' Features ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● High efficiency cake loading component, aluminum box loading; ● Automatic cassette loading, double cassette stacked loading; ● Supports flexible expansio... Ver más
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Equipo de embalaje de semiconductores de alta eficiencia
Precio: Negotiable
MOQ: 1 set
El tiempo de entrega: 40 days
Marca: TJIN
Destacar:Highly efficient Semiconductor Packaging Equipment, Highly efficient ic packaging Equipment
Semiconductor Packaging Equipment Features ● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products; ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● High efficiency cak... Ver más
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Sistema de encapsulación automática del chip
Precio: Negotiable
MOQ: 1 set
El tiempo de entrega: 40 days
Marca: TJIN
Destacar:Auto Chip Encapsulation System, Auto Chip encapsulation equipment
Auto Chip Encapsulation System Packing and Shipping: Packaging and Shipping for Semiconductor Molding Equipment Our Semiconductor Molding Equipment is carefully packaged to ensure safe delivery to our customers. Each unit is packed in a sturdy wooden crate with foam padding to protect against any da... Ver más
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Equipo de fabricación de semiconductores de transferencia de chips Refrigeración por agua
Precio: Negotiable
MOQ: 1 set
El tiempo de entrega: 40 days
Marca: TJIN
Destacar:Chip Transfer Molding semiconductor manufacturing equipment, Chip Transfer Molding semiconductor manufacturing machine, Semiconductor Manufacturing Equipment Water Cooling
Product Description: Semiconductor Molding Equipment Product Overview The Semiconductor Molding Equipment is a fully automatic molding system designed for the production of high-quality semiconductor products. This advanced equipment utilizes state-of-the-art technology and features to ensure effici... Ver más
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Equipo de moldeo de semiconductores confiables funcionan sin problemas controlados por PLC
Precio: Negotiable
MOQ: 1 set
El tiempo de entrega: 40 days
Marca: TJIN
Destacar:Reliable Semiconductor Molding Equipment, Reliable semiconductor molding machine, PLC Controlled Semiconductor Molding Equipment
TJIN Semiconductor Molding Equipment Product Description: Semiconductor Molding Equipment Product Overview The Semiconductor Molding Equipment is a fully automatic molding system designed for the production of high-quality semiconductor products. This advanced equipment utilizes state-of-the-art tec... Ver más
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Equipo de embalaje de semiconductores de alta productividad Dispositivo de moldeo de chips
Precio: Negotiable
MOQ: 1 set
El tiempo de entrega: 40 days
Marca: TJIN
Destacar:High Productivity Semiconductor Packaging Equipment, High Productivity Chip Molding Device
Chip Molding Device 【Performance Parameters】 ● Model pressure: 98-1764kn; ● injection molding pressure: 4.9-29.4kn can be adjusted; ● Applicable lead frame/substrate size: 20-90mm wide, 124-300mm long; ● Applicable plastic seal size: diameter φ 11 ~ 20mm, length 12 ~ 35mm; Semiconductor plastic seal... Ver más
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Equipo de moldeo de semiconductores de ahorro de energía
Precio: Negotiable
MOQ: 1 set
El tiempo de entrega: 40 days
Marca: TJIN
Destacar:Energy Saving Semiconductor Molding Equipment, Energy Saving semiconductor molding machine, Semicon Transfer Molding Equipment
Auto Semicon Transfer Molding Product Description: Semiconductor Molding Equipment Product Overview The Semiconductor Molding Equipment is a fully automatic molding system designed for the production of high-quality semiconductor products. This advanced equipment utilizes state-of-the-art technology... Ver más
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Industria de semiconductores Equipo de embalaje de circuitos integrados Sistema de moldeo de chips automatizado
Precio: Negotiable
MOQ: 1 set
El tiempo de entrega: 40 days
Marca: TJIN
Destacar:Semiconductor Industry IC Packaging Equipment, Semiconductor Industry Chip Molding System, IC Packaging Equipment Automated
Chip Molding System Semiconductor packaging equipment is mainly used in TO, SOP, SSOP, TSSOP, DIP, SOT, ESOT, SOD, QFN, SMA, SMC, SMBF, MBF, JA, QFP, IPM, BGAPDFNOFP and other semiconductor devices, IC , Chip one -stop automatic packaging test. Product Description: Semiconductor Molding Equipment Th... Ver más
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Equipo de moldeo de semiconductores de alta eficiencia Sistema de moldeo de chips 50/60Hz
Precio: Negotiable
MOQ: 1 set
El tiempo de entrega: 40 days
Marca: TJIN
Destacar:High Efficient Semiconductor Molding Equipment, High Efficient Chip Molding System, Semiconductor Molding Equipment 60Hz
Semiconductor Chip Molding System 【Features】 ● Semiconductor packaging equipment is also known as chip packaging equipment and IC packaging equipment, semiconductor MOLDING packaging equipment; ● Automatic packaging test chip, semiconductor device, IC and other products; ● Full servo control system,... Ver más
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Máquina de moldeo de semiconductores de inyección única
Precio: Negotiable
MOQ: 1 set
El tiempo de entrega: 40 days
Marca: TJIN
Destacar:Single Injection semiconductor molding machine, Single Injection semiconductor fab equipment, Semiconductor Molding Machine Fully Automatic
Fully Automatic Transfer Molding 【Performance Parameters】 ● Model pressure: 98-1764kn; ● injection molding pressure: 4.9-29.4kn can be adjusted; ● Applicable lead frame/substrate size: 20-90mm wide, 124-300mm long; ● Applicable plastic seal size: diameter φ 11 ~ 20mm, length 12 ~ 35mm; ● Full servo ... Ver más
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Equipo de producción de semiconductores automáticos completos para moldeo por inyección
Precio: Negotiable
MOQ: 1 set
El tiempo de entrega: 40 days
Marca: TJIN
Destacar:Full Auto Semiconductor Production Equipment, Injection Molding Semiconductor Production Equipment, Injection Molding semiconductor fab equipment
Automatic Molding System Product Description: Semiconductor Molding Equipment Our Semiconductor Molding Equipment is designed specifically for the semiconductor industry and offers a fully automatic molding system with advanced control capabilities. With our state-of-the-art PLC control system, our ... Ver más
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Equipo de moldeo de semiconductores de 90KW Dispositivo de moldeo de transferencia de semicones
Precio: Negotiable
MOQ: 1 set
El tiempo de entrega: 40 days
Marca: TJIN
Destacar:90KW Semiconductor Molding Equipment, Semicon Transfer Molding Device, 90KW semiconductor molding machine
Semicon Transfer Molding 【Performance parameters】 ● Model pressure: 98-1764kn; ● injection molding pressure: 4.9-29.4kn can be adjusted; ● Applicable lead frame/substrate size: 20-90mm wide, 124-300mm in length, 0.15-1.2mm thick; ● Applicable plastic seal size: diameter φ 11 ~ 20mm, length/diameter ... Ver más
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Equipo de moldeo de semiconductores de alta productividad Sistema de moldeo automático de chips
Precio: Negotiable
MOQ: 1 set
El tiempo de entrega: 40 days
Marca: TJIN
Destacar:High Productivity Semiconductor Molding Equipment, High Productivity Chip Molding System, Chip Molding Semiconductor Molding Equipment
Auto Chip Molding System Technical Parameters: Parameter Value Maintenance Easy Control System PLC Application Semiconductor Industry Capacity High Cycle Time Short Safety Features Advanced Molding Method Injection Molding Precision High Energy Consumption Low Pressure Control Precision Pressure Con... Ver más
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Equipo de moldeo de semiconductores eléctricos Sistema de encapsulación de semiconductores
Precio: Negotiable
MOQ: 1 set
El tiempo de entrega: 40 days
Marca: TJIN
Destacar:Semiconductor Molding Equipment Semicon Encapsulation, Electric Powered Semiconductor Molding Equipment, Electric Powered semiconductor molding machine
Auto Semicon Encapsulation System Features ● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products; ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● High efficiency cak... Ver más
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Sistema de encapsulación de chips Equipo de fabricación de semiconductores Eficiencia energética
Precio: Negotiable
MOQ: 1 set
El tiempo de entrega: 40 days
Marca: TJIN
Destacar:Chip Encapsulation semiconductor fab equipment, Semiconductor Fab Equipment Energy Efficient, Chip Encapsulation System Energy Efficient
Auto Chip Encapsulation System Technical Parameters: Attribute Value Product Type Molding Equipment Application Semiconductor Industry Precision High Control System PLC Temperature Control Precision Temperature Control Automation Fully Automated Molding Method Injection Molding Energy Consumption Lo... Ver más
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Máquinas para la fabricación de chips de semiconductores con prensa de plastificación automática Certificado ISO9001
Precio: Negotiable
MOQ: 1 set
El tiempo de entrega: 40 days
Marca: TJIN
Destacar:Auto Plasticizing Press Chip Manufacturing Machines, ISO9001 Semiconductor Chip Manufacturing Machines, ISO9001 chip manufacturing equipment
Auto Plasticizing Press Machine Product Detail: ● Full servo control system, PLC (Omron)+upper machine; ● Win10+15 -inch touch screen+touch keyboard; ● CCD image detection, feed anti -counter -anti -detection ● Standardized mold structure, convenient replacement; ● High -efficient ingredients, cakes... Ver más
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Equipo de moldeo de semiconductores de la prensa de plastificación de chips 380V 50Hz
Precio: Negotiable
MOQ: 1 set
El tiempo de entrega: 40 days
Marca: TJIN
Destacar:Chip Plasticizing Press Semiconductor Molding Equipment, Chip Plasticizing Press semiconductor molding machine, Semiconductor Molding Equipment 380V
Chip Plasticizing Press Customization: TJIN Semiconductor Molding Equipment Customized Service Brand Name: TJIN Model Number: 002 Place of Origin: China Precision: High Capacity: High Maintenance: Easy Control System: PLC Safety Features: Advanced Our company, TJIN, specializes in providing customiz... Ver más
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Máquinas de fabricación de semiconductores de alta automatización Equipo de moldeo de semiconductores
Precio: Negotiable
MOQ: 1 set
El tiempo de entrega: 40 days
Marca: TJIN
Destacar:highly Automation semiconductor fabrication machines, highly Automation Semicon Molding Equipment
Auto Semicon Molding Equipment Technical Parameters: Attribute Value Product Type Molding Equipment Application Semiconductor Industry Precision High Control System PLC Temperature Control Precision Temperature Control Automation Fully Automated Molding Method Injection Molding Energy Consumption Lo... Ver más
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