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Cojín termal libre del silicón
(11)
cojín de 2Kgf/Cm2 4W/M.K Silicone Free Thermal para la CPU
Precio: Negotiation
MOQ: Negotiation
El tiempo de entrega: 3~7 Days
Destacar:4W/m.K silicone free thermal pad, 4W/m.K thermally conductive gap pad, 2Kgf/cm2 thermally conductive gap pad
Hardnss 60 Shore C 4W/mK Thermal Conductive Silicone-Free Gap Filler Pad For CPU Product Description LM-NG400 thermal conductive silicone-free gap filler pad, no silicone oil, no pollution, no oil leakage during long-termhigh-temperature use, especially suitable for heat dissipation of components se... Ver más
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cojín termal libre del silicón de 1.8g/Cm3 150psi para GPU
Precio: Negotiation
MOQ: Negotiation
El tiempo de entrega: 3~7 Days
Destacar:150psi silicone free thermal pad, 1.8g/cm3 thermally conductive gap filler, 150psi thermally conductive gap filler
High Performance Tensile Strength 150psi Silicone-Free Thermal Pad For CUP/GPU Product Description Non-silicone thermal pads are base on special resins. They donot make circuit failure ,because they donot have siloxane volatilization and silicone oil seeping. The products have good tensile strength ... Ver más
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No cojín termal del reemisor de isofrecuencia del silicón 1.8g/Cc 150psi
Precio: Negotiation
MOQ: Negotiation
El tiempo de entrega: 3~7 Days
Destacar:150psi thermal gap filler pad, 1.8g/cc thermal gap filler pad, 150psi non silicone thermal pad
1.5W Thermal Pad Tensile Strength 150psi Conductive Silicone-Free Gap Filler Pad Product Description LM-NG150 use special resin system to replace the traditional system of silicone oil, after special curing forming and vacuum processing technology, the silicone-free thermal pad has been made. This p... Ver más
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cojín termal libre del silicón de la orilla 00 del grueso 60 de 5.0m m para el disco duro
Precio: Negotiation
MOQ: Negotiation
El tiempo de entrega: 3~7 Days
Destacar:60 Shore 00 thermal gap filler pad, 60 Shore 00 silicone free thermal pad, 5.0mm thickness thermal gap filler pad
Thickness 0.5~5.0mm Non-Silicone Thermal Pad Thermal Gap Filler Pad For Hard Disk Product Description LM-NG400 is high-performance,thermal conductive gap filling materials, mainly for the transmission interface between the electronic equipment,and heat sink or product outer coving. With nice stickin... Ver más
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cojín termal libre del silicón de 30psi 2.3g/Cc 2.0W/Mk
Precio: Negotiation
MOQ: Negotiation
El tiempo de entrega: 3~7 Days
Destacar:2.3g/cc thermal gap pad, 2.0W/mk silicone free thermal pad, 30psi thermal insulation pad
Operating Temperature-40°C ~ 120°C high Thermal Conductivity Silicone-Free Pad Product Description LM-NG300 use special resin system to replace the traditional system of silicone oil, after special curing forming and vacuum processing technology, the Non-silicone thermal pad had been made. This prod... Ver más
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Cojín aislador de 0.34Mpa 1.2W/M.K Silicone Free Thermal
Precio: Negotiation
MOQ: Negotiation
El tiempo de entrega: 3~7 Days
Destacar:1.2W/M.K silicone free thermal pad, 1.2W/M.K thermal conductive pad, 0.34Mpa thermal conductive pad
High Thermal Conductivity Silicone-Free Thermal Pad 1.2W/MK Thermal Conductive Pad Product Description Thermal silicone pad is a high-performance heat conducting interface material. Bedding on the gap between the heat device and the heat sink or the machine shell to extrude air to reach the full con... Ver más
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llenador de 8kg/Cm2 6.0w/M.K Thermally Conductive Gap
Precio: Negotiation
MOQ: Negotiation
El tiempo de entrega: 3~7 Days
Destacar:8kg/cm2 GPU Thermal Pad, 6.0w/m.k thermally conductive gap filler, 6.0w/m.k heat dissipation pad
Flame Rating 94-V0 Silicone Free Heat Dissipation Pad Laptop GPU Thermal Pad Product Description The NG series high performance, thermal conductive pad designed with extremely high thermal conductivity and fitting performance, which is from the boron nitride powder of the raw material compound, its ... Ver más
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grueso 12.8W/M.K Electrical Insulation Pad de 1.5m m
Precio: Negotiation
MOQ: Negotiation
El tiempo de entrega: 3~7 Days
Destacar:12.8W/m.k electrical insulation pad, 12.8W/m.k silicone free thermal pad, 1.5mm thickness electrical insulation pad
Thermal Conductive Silicone-Free Gap Filler Pad For CPU Without Silicone Oil Product Description LM-NG280 Silicone-free thermal pad, no siloxane metal oxide filler, no silicone oil, no pollution, no oil leakage during long-termhigh-temperature use, especially suitable for heat dissipation of compone... Ver más
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25 cojín conductor de la orilla C 2.4g/Cc termalmente Gap para el ordenador portátil
Precio: Negotiation
MOQ: Negotiation
El tiempo de entrega: 3~7 Days
Destacar:2.4g/cc thermal cooling pad, 25 shore C adhesive thermal pad, 2.4g/cc thermal gap pad
Thermal Conductive Cool Silicone Free Gap Pad For High Temperature Product Description Thermal silicone free material is high-performance,thermal conductive gap filling materials, mainly for the transmission interface between the electronic equipment,and heat sink or product outer coving. With nice ... Ver más
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60 cojín de Shore00 4.5W/M.K Thermal Interface Material
Precio: Negotiation
MOQ: Negotiation
El tiempo de entrega: 3~7 Days
Destacar:4.5W/m.K silicon free thermal pad, 60 Shore00 thermal interface pad, 4.5W/m.K heatsink thermal pad
High Quality Size 400*200*1.0MM Heatsink Silicon-Free Thermal Pad Used For RFID Product Description LM-NG450 is a filler thermal interface material with great thermal performance and high compliancy. And it maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out ... Ver más
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Hoja de aislamiento de almohadilla térmica sin silicona de alta temperatura para computadora portátil
Precio: Negotiation
MOQ: Negotiation
El tiempo de entrega: 3~7 Days
Destacar:Insulation Silicone Free Conductive Pad, Laptop Silicone Free Thermal Pad, 15mm Silicone Free Thermal Pad
High Temperature Silicone Free Conductive Pad For Laptop Excellent High Elastic Viscosity Rigorous workmanship,the product is clean and tidy as a whole,without foaming or overflowing glue,and can be cut and processed at will, which can fll the gap well and can dissipate heat after one paste Soft Sho... Ver más
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