Máquina de unión de circuitos integrados
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Máquina de unión de circuitos integrados
Precio: Negotiable
MOQ: ≥1 pc
El tiempo de entrega: 25~50 days
Marca: Suneast
Destacar:combined selective multi module wave solder, wave soldering multi module combined selective, combined multi module wave solder selective
IC Bonding Machine The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image processing unit and architecture. IC bonder is suit able for IC... Ver más
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Máquina de unión de circuitos integrados de múltiples capas 0,25*0,25mm-10*10mm Equipo de unión a presión
Precio: Negotiable
MOQ: ≥1 pc
El tiempo de entrega: 25~50 days
Marca: Suneast
Destacar:soldering combined multi module wave selective, selective multi module combined wave soldering, combined wave soldering selective multi module
High Precision Multilayer Capability Quick Changeover IC Bonding Machine WBD2200 The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image p... Ver más
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Máquina de unión IC de alta precisión 8-12 pulgadas Wafers Die Bonders
Precio: Negotiable
MOQ: ≥1 pc
El tiempo de entrega: 25~50 days
Marca: Suneast
Destacar:combined wave soldering multi module selective, magnetic spring motor ce iso, iso ce magnetic spring motor
Automatic Nozzle Change High Precision IC Bonding Machine WBD2200 PLUS 8-12 Inch Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic ... Ver más
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Máquina de unión a presión de IC de cambio rápido Máquina de unión a presión de chip supermini
Precio: Negotiable
MOQ: ≥1 pc
El tiempo de entrega: 25~50 days
Marca: Suneast
Destacar:wave soldering selective combined multi module, multi module combined wave soldering selective, multi module wave soldering selective combined
Supermini Chip Placement Quick Changeover IC Bonder CBD2200 Special use type high precision IC bonder, for a variety of small batch of placement products. It can automatically switch to a variety of bonding heads, and quickly realize the placement of different parameters of a variety of chips. Featu... Ver más
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Máquina de unión de circuitos integrados de alta velocidad con huella pequeña Máquina de unión de plataforma modular
Precio: Negotiable
MOQ: ≥1 pc
El tiempo de entrega: 25~50 days
Marca: Suneast
Destacar:spring motor ce iso magnetic, motor iso magnetic spring ce, selective wave solder multi module combined
Productive High Speed Small footprint IC Bonder CBD2200 EVO Modular Platform Design Features: High speed, accurate solidification capacity ±10um@3σ; High production efficiency, low cost input High multi-chip processing capacity, support 16 different types of chip placement High flexibility to suppor... Ver más
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Sinterizado en el depósito SDB 200
Precio: Negotiable
MOQ: ≥1 pc
El tiempo de entrega: 25~50 days
Marca: Suneast
Destacar:selective multi module combined wave solder, wave solder combined selective multi module, selective wave solder combined multi module
Automatic Compact Structure Sintering Die Bonder SDB200 Wafer Loading Introduction: It is designed for power semiconductor IC bonding market, equipped with more powerful BONDHEAD system, which possesses functions like high precision bonding, pressure holding circuit maintaining and heating, achievin... Ver más
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