Fabricación del substrato del ic de la memoria de base FR4
Precio: US 0.089-0.109 each piece
MOQ: 1000pieces
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:0.4mm Electronic Printed Circuit Board, Smooth Solder Resist Printed Circuit Board, 0.4mm Printed Circuit Board
Description Of IC Substrate pcb Above IC substrate is a type of memory chip ic package substrate,Which is widely use for memory card,High tg FR4 (170tg),ENIG gold wire bonding substrate. Application: Memory electronics MicroSD TF card IC Package,Semiconductors electronics Semiconductor IC package S... Ver más
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Capa ENEPIG de BT FR4 NAND Memory Substrate Board 35/35um 4
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:NAND Memory Substrate Board, BT FR4 Memory Substrate Board, ENEPIG FR4 Package Substrate
Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate, Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,Ohmeg... Ver más
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PWB ultra fino del grueso L/S 35um de 0.1m m 0.4m m
Precio: US 0.11-0.13 each piece
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:50um Line Space Ultra Thin Pcb, 0.4mm Ultra Thin Pcb, 0.1mm Ultra Thin Pcb
Thickness 0.1-0.4mm Ultralthin PCB With Minimum 25um Line Width And 50um Line Space Application:writing pad/touch pad,consumer electronics,Smart electronics; Mini.Line space/width:1mil (25um) Spec.of pcb production: FR4 (0.15mm) finished thickness; FR4 brand:SHENGYI or customize; Surface finished:im... Ver más
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Fabricación del substrato de IC de la microelectrónica
Precio: US 95-120 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Halogen Free PCB Circuit Board, ODM PCB Circuit Board, Bonding Halogen Free PCB
Application:Memory card/UDP,IC substrate.IC package,IC assembly,TF card,MrcroSD card;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.28mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4... Ver más
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1mil línea placa de circuito impresa rígida ultrafina de la anchura
Precio: US 120-150 per square meter
MOQ: 100pieces
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Complex Rigid Printed Circuit Board, 1mil Line Width Printed Circuit Board, 1mil Line Width Rigid Circuit Board
Description Of IC Substrate pcb 0.12mm ultrathin FR4 print circuit boards is still belong to rigid FR4 pcb boards,ultrathin pcb boards. Application: Consumer electronics Spec.of pcb production: Mini.Line space/width 35/35um - 20/20um - 10/10um Finished Thk. 0.12mm Raw material SHENGYI,Mitsubishi,mi... Ver más
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fabricación del substrato del paquete de la microelectrónica
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Black Soldermask LED PCB Board, Black Soldermask led lamp pcb, LED PCB Board With total Pad
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory,Microelectronics assembly,Microelectronics package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPl... Ver más
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producción del substrato de la tarjeta microSD 4Layer
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Rohs Pcb Gold Finger Plating, High Density Pattern Pcb Gold Finger, Custom Pcb Gold Finger Plating
Description Of IC Substrate pcb IC Package Substrate, IC Package Substrate, is a key carrier in the packaging and testing process, used to establish signal connections between IC and PCB, in addition to protecting circuits, fixing lines, and dissipating residual heat. Application: NAND memory Flash... Ver más
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Tablero ultra fino del PWB del grueso de la asamblea 0.2m m de IC
Precio: US 0.11-0.13 each piece
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:0.2mm Ultra Thin Pcb, IC Assembly Ultra Thin Pcb, 0.2mm Thin Pcb Board
Thickness 0.1-0.4mm Ultralthin PCB with Halogen Free Material/gold plating Application:IC substrate/IC assembly/IC package/IoT electronics,Memory card more! Mini.Line space/width:1mil (25um) Spec.of pcb production: FR4 (0.1-0.4mm) finished thickness; Material of FR4 brand,Support customize;Support J... Ver más
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Fabricación rígida ultrafina modificada para requisitos particulares del PWB
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Ultrathin Rigid PCB Fabrication, Customized Ultrathin Rigid PCB, Customized Ultrathin Rigid PCB Fabrication
high quality gold plating ultrathin printed circuit board fabrication with customize/BT FR4/IC substrate Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,U... Ver más
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Horexs 0.15m m tablero del PWB de 2 capas para la batería de litio
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:0.15mm 2 Layer Pcb Board, Horexs 2 Layer Pcb Board, Horexs Pcb Board For Lithium Battery
0.15mm finished thickness High Precision Ultrathin PCB with Halogen Free Material,ROHS for Lithium Battery Application:Lithium Battery,0.15mm finished thickness FR4 PCB; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Ma... Ver más
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Paquete de BGA de substrato de la memoria con la superficie suave del oro de ENEPIG ENIG
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:MicroSD BGA Substrate, TF Memory BGA Substrate, ENEPIG BGA Substrate
MicroSD / TF Memory Substrate Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; When you send inquiry us,Pls be know that we have to get the following : 1-substrate production sepc. information; 2-Gerber files(substrate designer/engineer ca... Ver más
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PWB del substrato del paquete de IC del eMMC
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:eMMC IC Package Substrate PCB, IC Package Substrate eMMC, eMMC PCB
eMMC IC package substrate pcb For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,consumer electronics. Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC ... Ver más
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PWB rígido ultrafino de 0.4m m
Precio: US 150-165 per square meter
MOQ: 10 squre meters
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:0.4mm Ultrathin Rigid PCB, Ultrathin Rigid PCB 0.4mm, 0.4mm Ultrathin PCB
0.4mm finished FR4 circuit boards fabrication with High Quality Gold Plating PCB Board Taiyo White Solder Mask ROHS Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC subs... Ver más
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Substrato material L/S 35/35um de Pacakge del semiconductor de BT
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:BT FR4 BOC Pacakge Substrate, Improved Tenting BOC Pacakge Substrate, BOC Pacakge fr4 substrate
BOC pacakge substrate manufacture with short delivery time Application:Memory package,Memory packaging substrate,Dram/LPDDR/DDR package substrate,Semiconductor package; Spec.of pcb production: Mini.Line space/width 1mil (20um) Finished thickness BT (0.1-0.4mm) finished thickness Mainly brand SHENGYI... Ver más
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Enchufe lleno de la resina del substrato del paquete del grueso BGA de Horexs 0.2m m todos los agujeros y galjanoplastia del casquillo
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:0.2mm Mini PCB Board, Horexs LED PCB Board, Horexs Mini PCB Board
Horexs 0.2mm Thickness full resin plug all holes and cap plating Application:MicroLED,MiniLED,LED display,LED displays; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsui... Ver más
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Fabricación del substrato del paquete de MicroLED/MiniLED
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Fine Pitch Micro Pcb Board, Micro Pcb Board No Chromatism, Fine Pitch Pcb For Outdoor Led
Fine Pitch Micro Pcb Board with none misregistration SR Application:LED display,LED displays,Lighting pcb,outdoor Led; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:BT/FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseik... Ver más
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Fabricación de múltiples capas del substrato del paquete del semiconductor de los materiales de BT
Precio: US 0.1-0.12 each piece
MOQ: 1000pieces
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:4 Layer fr4 circuit board, 0.3mm Rigid Circuit Boards, VCP Gold Plated Rigid Circuit Boards
Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor package,Memory electronics,NAND/Fl... Ver más
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Fabricación ultrafina del PWB del PWB de la identificación de la huella dactilar
Precio: US 180-210 per square meter
MOQ: 10 squre meters
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Substrate Printed Circuit Board, IC Package Substrate Circuit Board, Printed Circuit Board for Fingerprint Identification
Description Of IC Substrate pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the chips and PCBS. Additionally,the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of I... Ver más
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Materia prima de Hitachi BT del substrato del montaje BGA del semiconductor de ENEPIG
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Half Hole BGA Substrate, ENEPIG BGA Substrate, BT FR4 Package Substrate
Application:FC package substrate,FlipChip substrate,Flipchip CSP,.FBGA/LGA/PBGA/WBGA substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubi... Ver más
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El alambre de ENIG/muere fabricación de empaquetado del substrato de IC de BGA del substrato en enlace del paquete
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Wire Bond BGA Substrate, ENIG BGA Substrate, IC Packaging Substrate Board
Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; M... Ver más
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