Formulario de embalaje a nivel de panel
(3)
Tamaño del panel 310*320mm Nivel del panel QFN Baja resistencia eléctrica
Precio: Negotiable
MOQ: Negotiable
El tiempo de entrega: Negotiable
Description: 310*320mm panel size, Chip size: 0.76*0.61mm; Package size: 2.76*1.97mm; Package thickness: 360um, Application: Power management, Process introduction: The coming wafer is bumped with Cu post (e.g., 50 micro meters), after thining and dicing of wafer, chips with bump are picked and plac... Ver más
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0.5 mm de espesor Nivel del panel de embalaje Nivel del panel BGA/CSP Para adaptador de alimentación
Precio: Negotiable
MOQ: Negotiable
El tiempo de entrega: Negotiable
Marca: FZX Fanout Process and Product
Description: 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Process introduction: After the chip is picked and placed onto the temporary carrier board, the packaging process is carried out by compression molding, plasma c... Ver más
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Nivel de panel Embalaje Nivel de panel SiP utilizado en diversas industrias
Precio: Negotiable
MOQ: Negotiable
El tiempo de entrega: 1 month
Marca: FZX Fanout Process and Product
Description: 310*320mm panel size; Advantage:Small SiP package size,such as 6*6mm/7.5*7.5mm;low power consumption;multi-chip packages, high assembly efficiency. Technical capability: different functional dies are assembled in one system,for example, MCU, Bluetooth and some passive chips are assemble... Ver más
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