Tamaño del panel 310*320mm Nivel del panel QFN Baja resistencia eléctrica
Precio: Negotiable
MOQ: Negotiable
El tiempo de entrega: Negotiable
Description: 310*320mm panel size, Chip size: 0.76*0.61mm; Package size: 2.76*1.97mm; Package thickness: 360um, Application: Power management, Process introduction: The coming wafer is bumped with Cu post (e.g., 50 micro meters), after thining and dicing of wafer, chips with bump are picked and plac... Ver más
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Tamaño del panel 310*320mm Chip MOS delgado Silicio Bajo consumo de energía
Precio: Negotiable
MOQ: 3000pcs
El tiempo de entrega: 1 month
Marca: FZX Fanout Process and Product
Description: Multi-chip MOSFET 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Applications: Military applications, new energy vehicles, Power adapter, power amplifier, automotive electronics, etc. Competitive Advantage: 1... Ver más
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Envasado a nivel de panel cara hacia abajo EWLB Alta disipación del calor Alta fiabilidad
Precio: Negotiable
MOQ: Negotiable
El tiempo de entrega: Negotiable
Description: 1,Compared with traditional packaging methods (e.g., wire bond and substrate), it has the obvious characteristics of high heat dissipation (thick Cu), high reliability (short connection and strong surface adhesion), high voltage and high current (thick Cu). 2,It can be used in various a... Ver más
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Embalaje de nivel de panel de ventilador de 310*320 mm (FOPLP) GaN Producto
Precio: Negotiable
MOQ: 3000pcs
El tiempo de entrega: 1 month
Marca: FZX Fanout Process and Product
310*320mm Panel size; DIE1 size:1.89*1.64mm; DIE2 size:0.926*0.626mm; Package size:6*7mm; Package thickness: 0.42mm; Process flow: The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the ba... Ver más
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Alta relación de aspecto TGV Capacidades de fundición para envases de semiconductores
Precio: Negotiable
MOQ: 10 panel
El tiempo de entrega: 1 month
Marca: FZX -TGV
Description: As shown in the following table, the glass core substrate with 510mmX515mm size can be manufactured inside the manufacturing line. The glass thickness is varied from 0.3mm to 1.5mm (some can be extended to 5mm thick). The aspect ratio (diameter/ thickness of glass)can be varied from 1:1... Ver más
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Envase adecuado para diversos experimentos de simulación de envases
Precio: Negotiable
MOQ: 3000pcs
El tiempo de entrega: 1 month
Marca: FZX
Description: 1. Support WBBGA, FCBGA, WLCSP, POP, FO, 2.5D and other package types of electromagnetic, thermal, structural and mode flow simulation. 2. From the electrical simulation of chip to system, SI analysis and PI analysis of package design are realized. 3. Key process feasibility simulation ... Ver más
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