Estructura del producto de embalaje a nivel de panel
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Envasado a nivel de panel cara hacia abajo EWLB Alta disipación del calor Alta fiabilidad
Precio: Negotiable
MOQ: Negotiable
El tiempo de entrega: Negotiable
Description: 1,Compared with traditional packaging methods (e.g., wire bond and substrate), it has the obvious characteristics of high heat dissipation (thick Cu), high reliability (short connection and strong surface adhesion), high voltage and high current (thick Cu). 2,It can be used in various a... Ver más
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Embalaje a nivel de panel de ventilación (FOPLP) - Estructura del producto (en sentido ascendente) - Golpe en la obletera
Precio: Negotiable
MOQ: 3000pcs
El tiempo de entrega: 1 month
Marca: FZX Fan-Out Panel Level Packaging
Description: Die with bump of MOS&MOS-Like package can be picked and placed onto the temporary carrier; C mold is performed after above die placement with face-up methodology. The mold grinding, PVD and plating will be made for RDL. The TMV will be made for the top/bot layer connection. The surf... Ver más
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Embalaje de nivel de panel de ventilación (FOPLP) - Estructura del producto (en sentido ascendente) - Esfera de fijación de alambre
Precio: Negotiable
MOQ: 3000pcs
El tiempo de entrega: 1 month
Marca: FZX Fanout Process and Product
Description: As shown in above photo, compared with traditional packaging methods, the wire bond ball (copper or gold) can be made from wire bond process, it is similar to bump of chip, therefore, it has higher integration, high reliability, and low cost; through the FOPLP process , multiple MCU and... Ver más
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Embalaje a nivel de panel de ventilación (FOPLP) Estructura del producto Embalaje integrado
Precio: Negotiable
MOQ: 3000pcs
El tiempo de entrega: 1 month
Marca: FZX
Description: 1,Compared with traditional packaging methods, this advanced packaging replaces wire bond and substrate, therefore, it has demonstrated the characteristic of higher integration, high reliability, and low cost ; 2,While maintaining the original foot position design, it is much thinner an... Ver más
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