Experimentos de simulación de envases
(1)
Envase adecuado para diversos experimentos de simulación de envases
Precio: Negotiable
MOQ: 3000pcs
El tiempo de entrega: 1 month
Marca: FZX
Description: 1. Support WBBGA, FCBGA, WLCSP, POP, FO, 2.5D and other package types of electromagnetic, thermal, structural and mode flow simulation. 2. From the electrical simulation of chip to system, SI analysis and PI analysis of package design are realized. 3. Key process feasibility simulation ... Ver más
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