Substrato del paquete de FCCSP
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Color de verde del substrato 3x3m m del paquete de BT FCCSP para Flip Chip Assembly
Precio: US 85-100 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Green FCCSP Package Substrate, 3x3mm FCCSP Package Substrate, 0.3mm FCCSP Package Substrate
FCCSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,others; Applicable up to 35µm pitch for flip-chip assembly (peripheral) Thin build-up laminate for SiP applications... Ver más
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Fabricación del substrato de FCCSP que apoya China
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Gold Plating Soldermask Antenna PCB, 0.1mm Antenna PCB, 0.1mm 4 Layer PCB
Application:Consumer electronics,Internet electronics,telcommunication electronics,Others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.4mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,O... Ver más
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Material de BT del color verde del substrato 5x5m m del paquete de Flip Chip CSP
Precio: US 85-100 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:CSP package substrate, 5x5mm CSP package substrate, BT FCCSP Package Substrate
Flip Chip CSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,PC/Server : DRAM, SRAM,Smart Mobile Devices ,AP, Baseband, Finger print sensor, etc.Network : Bluetooth, RF... Ver más
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Substrato de paquetes FCCSP/FCBOC de alto rendimiento para DRAM y SRAM/LPDDR de PC/servidor
Precio: US 85-100 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Green CSP package substrate, BT CSP package substrate, BT PBGA package substrate
PBGA / CSP package substrate production supporting Application:IC assembly,Smart Mobile Devices, Notebook PC, video cameras, PLDs,Microprocessors & controllers, Gate Arrays, Memory, DSPs, PLDs,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electroni... Ver más
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Tipos ENEPIG de la acumulación del substrato 4L del paquete de FCCSP
Precio: US 85-100 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:0.2mm Antenna Circuit Board, Intelligent Handwriting Antenna Circuit Board, Large 0.2mm Antenna PCB
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Tacon... Ver más
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fabricación del substrato del paquete del semiconductor FCCSP
Precio: US 85-100 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Application:FCCSP package,IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Necl... Ver más
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Color de verde del substrato 3x3m m del paquete de BT FCCSP para Flip Chip Assembly
Precio: US 85-100 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Green Color FCCSP Package Substrate, Flip Chip FCCSP Package Substrate, BT FCCSP Substrate
FCCSP package substrate production supporting Product description IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts st... Ver más
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tipos material de la acumulación del substrato 4L del paquete de 0.3m m FCCSP de ENEPIG 5*5m m BT
Precio: US 85-100 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:ENEPIG FCCSP package substrate, Buildup Types FCCSP package substrate, 0.3mm FCCSP substrate
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Tacon... Ver más
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