Substrato de BGA
(27)
Capa ENEPIG de BT FR4 NAND Memory Substrate Board 35/35um 4
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:NAND Memory Substrate Board, BT FR4 Memory Substrate Board, ENEPIG FR4 Package Substrate
Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate, Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,Ohmeg... Ver más
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fabricación del substrato del paquete de la microelectrónica
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Black Soldermask LED PCB Board, Black Soldermask led lamp pcb, LED PCB Board With total Pad
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory,Microelectronics assembly,Microelectronics package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPl... Ver más
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Paquete de BGA de substrato de la memoria con la superficie suave del oro de ENEPIG ENIG
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:MicroSD BGA Substrate, TF Memory BGA Substrate, ENEPIG BGA Substrate
MicroSD / TF Memory Substrate Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; When you send inquiry us,Pls be know that we have to get the following : 1-substrate production sepc. information; 2-Gerber files(substrate designer/engineer ca... Ver más
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Substrato material L/S 35/35um de Pacakge del semiconductor de BT
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:BT FR4 BOC Pacakge Substrate, Improved Tenting BOC Pacakge Substrate, BOC Pacakge fr4 substrate
BOC pacakge substrate manufacture with short delivery time Application:Memory package,Memory packaging substrate,Dram/LPDDR/DDR package substrate,Semiconductor package; Spec.of pcb production: Mini.Line space/width 1mil (20um) Finished thickness BT (0.1-0.4mm) finished thickness Mainly brand SHENGYI... Ver más
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Enchufe lleno de la resina del substrato del paquete del grueso BGA de Horexs 0.2m m todos los agujeros y galjanoplastia del casquillo
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:0.2mm Mini PCB Board, Horexs LED PCB Board, Horexs Mini PCB Board
Horexs 0.2mm Thickness full resin plug all holes and cap plating Application:MicroLED,MiniLED,LED display,LED displays; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsui... Ver más
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Fabricación del substrato del paquete de MicroLED/MiniLED
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Fine Pitch Micro Pcb Board, Micro Pcb Board No Chromatism, Fine Pitch Pcb For Outdoor Led
Fine Pitch Micro Pcb Board with none misregistration SR Application:LED display,LED displays,Lighting pcb,outdoor Led; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:BT/FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseik... Ver más
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Materia prima de Hitachi BT del substrato del montaje BGA del semiconductor de ENEPIG
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Half Hole BGA Substrate, ENEPIG BGA Substrate, BT FR4 Package Substrate
Application:FC package substrate,FlipChip substrate,Flipchip CSP,.FBGA/LGA/PBGA/WBGA substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubi... Ver más
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El alambre de ENIG/muere fabricación de empaquetado del substrato de IC de BGA del substrato en enlace del paquete
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Wire Bond BGA Substrate, ENIG BGA Substrate, IC Packaging Substrate Board
Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; M... Ver más
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2-6 substrato de empaquetado del material BGA del taw de BT de la capa para el montaje del semiconductor
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:FR4 BGA Substrate, DRAM Memory Chip BGA Substrate, FCBGA Package Substrate
Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material... Ver más
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El substrato ENEPIG de la capa CSP de BT FR4 4 mejoró Tenting
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:BT FR4 CSP Substrate, 4 Layer CSP Substrate, ENEPIG BGA Package Substrate
Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; Material brand:Mainly bran... Ver más
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0.28m m acabaron la fabricación sin plomo del substrato del chip de memoria
Precio: US 1.3-1.1 each piece
MOQ: 100pieces
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Lead Free Fr4 Printed Circuit Board, 0.25mm Fr4 Printed Circuit Board, 0.25mm Lead Free Circuit Board
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.28mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... Ver más
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Producción del substrato del paquete del semiconductor del material BGA de BT
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:FR4 Finished BGA Substrate, 1mil BGA Substrate, Customize Soldermask BGA Substrate
All types BGA of memory substrate manufacture China Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Short introduction of Horexs Manufacturer: HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC subst... Ver más
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El cobre del substrato 0.5oz del paquete del MCP modifica el material de BT para requisitos particulares
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Immersion Gold FR4 Substrate, 0.5oz Copper MCP Substrate, MCP FR4 Substrate
MCP Substrate Manufacture Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei provinc... Ver más
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IC Chip Substrate Fabrication con BT (MGC/Hitachi) ENIG/Soft gold/ENEPIG
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:MCP Chip Substrate Board Fabrication, BT ENIG Substrate Board Fabrication, 0.25mm Finished BGA Package Substrate
Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finish... Ver más
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BT ENEPIG 4 grueso acabado del substrato del paquete del sorbo de la capa 0.24m m
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:4 Layer Sip Package Substrate, BT ENEPIG Sip Package Substrate, 0.29mm Finished Package Chip Substrate
Application:Sip package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Sur... Ver más
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Oro suave de enlace del oro duro de la UL ENIG del substrato del alambre de L/S 30um BT
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:BT Wire Bonding Substrate, 35um Line Wire Bonding Substrate, UL ENIG IC Package Substrate
Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,Ohme... Ver más
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Producción del substrato del paquete de FBGA que apoya la base de BT 40um
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:4 Layer Flip Chip Substrate, BGA Package Chip Substrate, BT Core FCBGA Substrate
Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,FC package substrate,FlipChip substrate,Flipchip BGA substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickn... Ver más
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substrato de empaquetado del semiconductor de la fabricación de la memoria de la COPITA
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:BT FR4 Substrate Board, 35um Line Substrate Board, DRAM Memory Packaging FR4 Substrate
Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.15mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-F... Ver más
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Fabricación de sustratos para módulos de RF/mmwave
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:BT Pcb Printed Circuit Board, 2 Layer Pcb Printed Circuit Board, BT Black Pcb Circuit Board
Application:IC package,Microelectronics devices,Microelectronics assembly,Microelectronics package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-... Ver más
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substrato de empaquetado de la microelectrónica del substrato del montaje del semiconductor del grueso de 0.2m m
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:0.2mm Backlight Pcb, Keyboard Backlight Pcb, 0.2mm keyboard pcb board
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... Ver más
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