Substrato del paquete de IC
(47)PWB del substrato del paquete de IC del eMMC
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:eMMC IC Package Substrate PCB, IC Package Substrate eMMC, eMMC PCB
eMMC IC package substrate pcb For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,consumer electronics. Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC ... Ver más
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paquete de empaquetado del semiconductor del substrato del sorbo material de 4layer BT
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:MSAP Sip Packaging Substrate, BT Sip Packaging Substrate, 4layer CSP Semiconductor Substrate
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device;-PDA-Wireless R... Ver más
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0.2m m fabricación del substrato de la tarjeta de memoria de 2 capas para Capsulation
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:0.2mm Pcb Board Fabrication, Pcb Board Fabrication For Capsulation, 2 Layer Memory Card Pcb
Application:Memory card,Micro SD card,Micro TF card,UDP card,USB,Chip substrate ,IC assembly substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Min... Ver más
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Apoyo de la producción del substrato del paquete de Hitachi BT IC
Precio: US 0.11-0.13 each piece
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:BT IC Package Substrate, FR4 Printed Circuit Board Pcb, FR4 IC Package Substrate
Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semicondu... Ver más
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línea/espacio 25um FBGA Substrato para el embalaje de memoria
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:25um FCBGA Package Substrate, BGA FCBGA Package Substrate, Automotive FCBGA Memory Substrate
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device;-PDA-Wireless R... Ver más
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Fabricación del substrato del semiconductor del paquete de FBGA/PBGA/LGA
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:MEMS Semiconductor Substrate Boards, CMOS Semiconductor Substrate Boards, 1mil MEMS Memory Substrate
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device;-PDA-Wireless R... Ver más
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grueso de 0.15m m 2 capas de IC del substrato del paquete para el paquete de la memoria
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:0.15mm Thickness IC Package Substrate, 2 Layers IC Package Substrate, FR4 Substrate Printed Circuit Board
Memory Card PCB Produce by MEIKI Vacuum Laminator Direct use for Capsulation Application:Memory card,Micro SD card,Micro TF card,UDP card,USB,Chip substrate ,IC assembly substrate;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.o... Ver más
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Fabricación material del substrato de BT de la marca de Hitachi
Precio: US 0.1-0.12 each piece
MOQ: 1000pieces
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:IC Package Substrate Printed Circuit Board, Horexs IC Package Substrate, Complex Substrate Printed Circuit Board
Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semicondu... Ver más
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substrato del paquete de asamblea de 0.15m m IC para el paquete del semiconductor
Precio: US 0.1-0.12 each piece
MOQ: 1000pieces
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:0.15mm Ultrathin Pcb, Ultrathin Pcb Printed Circuit Board Assembly, 0.15mm Printed Circuit Board Assembly
Application:IC card,BANK card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF... Ver más
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Fabricación del substrato del paquete de AUS308 PSR IC
Precio: US 0.086-0.1 each piece
MOQ: 1000pieces
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Black Solder mask Pasted Fr4 Board, Black Fr4 Board BAG Bonding, Solder mask Pasted Fr4 Board
Application:UDP memory card,TF card,Memory card,SD card ,IC substrate pcb board;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.22mm; Material brand:... Ver más
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PWB del substrato del paquete de IC del almacenamiento
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Storage IC Package Substrate Pcb, Horexs IC Package Substrate Pcb, IC Package Substrate Horexs
Storage IC package substrate pcb For Storage IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,consumer electronics. Application:Semi Package,Semiconductors ,Semiconductor,IC packa... Ver más
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ENEPIG que platea la fabricación del substrato del paquete del ic
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:BT FR4 HDI Substrate, MSAP HDI Substrate, ENIG FlipChip Substrate
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device.Semiconductor,I... Ver más
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Substrato de empaquetado del Ic de la memoria de NAND/FLASH
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:FR4 Flash Memory Ic Substrate, 1mil Flash Memory Ic Substrate, Multiple Wafers Nand CSP Substrate
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device;-PDA-Wireless R... Ver más
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Material de BT del substrato del paquete de IC de la COPITA del proceso 25um de Tenting 4 capas
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:DRAM IC Substrate Packaging Board, 25um IC Substrate Packaging Board, BT MSAP Substrate
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device;-PDA-Wireless R... Ver más
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Substrato de empaquetado del semiconductor de CSP BGA 4 superficie de BT ENEPIG de la capa acabada
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:BGA IC Packaging Substrate, CSP IC Packaging Substrate, 4 Layer BT MSAP Substrate
Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,... Ver más
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Substrato del paquete de la tarjeta de memoria de BT BGA oro de la inmersión de 6 capas
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:BT Memory Card BGA Substrate, FR4 Memory Card BGA Substrate, 6layer Memory Card Storage Substrate
Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,... Ver más
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Tipos de la acumulación del cobre del substrato 12um del paquete del semiconductor
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:HDI IC Package Substrate, MEMS IC Package Substrate, 0.5oz Copper Flipchip Substrate
Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,... Ver más
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fabricación del tablero del substrato de 0.26m m BT BGA IC
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:BGA IC Substrate Board, 0.25mm IC Substrate Board, Immersion Gold BGA Substrate
Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.26mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,... Ver más
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chapado en oro suave del substrato del paquete de 25um BT IC
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:1mil BT IC Package Substrate, 0.5oz Copper IC Package Substrate, 0.25mm Thickness Module Substrate Board
Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,... Ver más
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Substrato de paquete de circuito integrado finleLine Space para dispositivos portátiles y electrónica automotriz
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:FBGA IC Packaging Substrate, FR4 IC Packaging Substrate, FBGA Semiconductor Substrate
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-.Power/Analog IC drive-Control drive IC for portable electronic device;-PDA-Wireless R... Ver más
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