Substrato de BGA
(27)
Capa ENEPIG de BT FR4 NAND Memory Substrate Board 35/35um 4
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:NAND Memory Substrate Board, BT FR4 Memory Substrate Board, ENEPIG FR4 Package Substrate
Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate, Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,Ohmeg... Ver más
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PWB del substrato del paquete de IC del eMMC
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:eMMC IC Package Substrate PCB, IC Package Substrate eMMC, eMMC PCB
eMMC IC package substrate pcb For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,consumer electronics. Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC ... Ver más
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Apile vía/vía el substrato de relleno BT del paquete del sorbo que 4L materiales combinan el sistema heterogéneo
Precio: US 99-120 each piece
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Stack Via Sip Package Substrate, Via Filling Sip Package Substrate, BT Sip Package Substrate
stack via/via filling Sip package substrate production supporting SiP (System in Package) SiP is the substrate that enables active devices with different functions to provide multi-functions associated with a system or sub-system in one single package. It is essential to next-generation package for ... Ver más
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Color de verde del substrato 3x3m m del paquete de BT FCCSP para Flip Chip Assembly
Precio: US 85-100 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Green FCCSP Package Substrate, 3x3mm FCCSP Package Substrate, 0.3mm FCCSP Package Substrate
FCCSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,others; Applicable up to 35µm pitch for flip-chip assembly (peripheral) Thin build-up laminate for SiP applications... Ver más
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Fabricación del substrato de los sensores de semiconductor
Precio: US 0.1-0.12 each piece
MOQ: 1000pieces
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Fingerprint Recognition PCB Board Fabrication, UL Fingerprint Recognition PCB, Fingerprint Recognition PCB For Intelligent Lock
Application:Fingerprint recognition electronics,IoT electronics,Semiconductors ,Semiconductor,IC package,Consumer electronics,Car electronics; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.17mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki... Ver más
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Oro suave material del control 4L BT de la impedancia del substrato del módulo del RF
Precio: US 0.089-0.109 each piece
MOQ: 1000pieces
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Goldfinger Fingerprint Recognition PCB, FR4 Fingerprint Recognition PCB, 0.15mm Fingerprint Recognition PCB
Application:Semiconductor package,IC package,WIFI module/Bluetooth module,Others; Spec.of Substrate production: Mini.Line space/width:1mil (35um) Finished thickness:0.21mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; S... Ver más
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producción del substrato de la tarjeta microSD 4Layer
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Rohs Pcb Gold Finger Plating, High Density Pattern Pcb Gold Finger, Custom Pcb Gold Finger Plating
Description Of IC Substrate pcb IC Package Substrate, IC Package Substrate, is a key carrier in the packaging and testing process, used to establish signal connections between IC and PCB, in addition to protecting circuits, fixing lines, and dissipating residual heat. Application: NAND memory Flash... Ver más
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Fabricación de múltiples capas del substrato del substrato del material MEMS/CMOS del ODM BT del OEM
Precio: US 120-150 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:OEM MEMS PCB, ODM MEMS PCB, BT Multilayer Circuit Board
Ultrathin MEMS PCB use OhmegaPly Cooper Foil and Mitsui Core Material Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,EMMC,CMOS,MEMS,IC assembly,Storage IC substrage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) fini... Ver más
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Producción del substrato del paquete de BGA/QFN para el semiconductor de la industria de IoT
Precio: US 0.1-0.12 each piece
MOQ: 1000pieces
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:4 Layer Camera Module PCB, Horexs Camera Module PCB, Horexs 4 Layer PCB
Application:Smart electronics,Smart healthy electronics,Smart agricultural electronics,IoT industry electronics,Smart express electronics ,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuis... Ver más
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Fabricación del substrato de IC de la microelectrónica
Precio: US 95-120 per square meter
MOQ: 1 square meter
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:Halogen Free PCB Circuit Board, ODM PCB Circuit Board, Bonding Halogen Free PCB
Application:Memory card/UDP,IC substrate.IC package,IC assembly,TF card,MrcroSD card;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.28mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4... Ver más
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Fabricación del substrato del ic de la memoria de base FR4
Precio: US 0.089-0.109 each piece
MOQ: 1000pieces
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:0.4mm Electronic Printed Circuit Board, Smooth Solder Resist Printed Circuit Board, 0.4mm Printed Circuit Board
Description Of IC Substrate pcb Above IC substrate is a type of memory chip ic package substrate,Which is widely use for memory card,High tg FR4 (170tg),ENIG gold wire bonding substrate. Application: Memory electronics MicroSD TF card IC Package,Semiconductors electronics Semiconductor IC package S... Ver más
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fabricación del PWB de la electrónica de la atención sanitaria/de la electrónica de la Micro-audiencia
Precio: US 85-120 each square meter
MOQ: 10 squre meters
El tiempo de entrega: 7-10 working days
Marca: Horexs
Destacar:0.2mm Medical Equipment PCB, Highly Intensive Medical Equipment PCB, 0.2mm Routed Circuit Board
Application:healthy electronics,Microelectronics devices,others; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Othe... Ver más
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